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[Hot Item] High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)

[Hot Item] High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)

Product Description Company Info. Overview Product Description Overview Basic Info. Model NO. Meister S SPI Precision High Precision Certification CE Warranty 12 Months Automatic Grade Automatic

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Product Details
  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
Meister S SPI
Precision
High Precision
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Max.Inspection Height
450um
Dimension W X D X H
800X907X1, 512mm
Camera Resolution
10/25um
Weight
800gk
Transport Package
Wooder Box
Specification
266*126*188
Trademark
Trademark
Origin
South Korea

Packaging & Delivery

Package Size
226.00cm * 128.00cm * 188.00cm
Package Gross Weight
800.000kg

Product Description

Product Description

Semiconductor Testing Solutions
The best mass production quality improvement solution specifically for semiconductor packaging & Mini/Micro-LED


Based on the precise three-dimensional measurement results provided by the detection equipment, Gao Ying focused on data management, analysis and optimization to achieve a truly intelligent factory. With the assistance of artificial intelligence (AI) technology, she enabled process automation. At the same time, through Gao Ying's process optimization solution - KPO solution, the printing and soldering processes were optimized in real time, helping users maximize production quality and productivity while reducing costs.

There is an emerging trend within semiconductor packaging and display markets. In an effort to improve production yield and reduce cost, OSATS, Chip Makers, Display, and Lighting manufacturers have increasingly been adopting flip chip-based processes to create next generation BGAs, SiPs, and FOWLPs (Fan-Out, Wafer-Level Packages), plus Mini- and Micro-LEDs. The Meister S SPI System is ideally suited for these demanding applications.

    High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)
BOYU is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.

We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.


All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.

Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .

High-speed camera, high-resolution optical solution (0.1μm Z resolution)
High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)
High-speed camera, high-resolution optical solution (0.1μm Z resolution)
Detection capability for micro-solder with a thickness exceeding 10μm (3.5μm diameter 50µm, 5µm diameter 70µm)

High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)
Powerful bending compensation solution
Flux detection of transparent bodies is carried out using a unique optical system

High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)
Powerful bending compensation solution
Flux detection of transparent bodies is carried out using a unique optical system.
High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)
Achieve zero-defect production innovation through the real-time process optimization solution based on artificial intelligence (AI) (KPO Printer)

High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)


KSMART Solution: Process control system based on true 3D measurement.
Koh Young pioneered True 3D measurement technology 20 years ago, ushering in a future of Zero Defects. This led to KSMART solutions and its continued utilization of
data and connectivity. KSMART Solutions focuses on data management, analysis and optimization, while automating processes with the help of artificial intelligence. It
collects data from the entire factory line to detect defects, optimize in real time, enhance judgment and trace problems to improve processes, improve quality and reduce costs by eliminating discrepancies, false positives and omissions.
Real-time process optimization solution based on artificial intelligence (AI) (KPO Printer)
Gaoying is committed to supporting intelligent production lines that achieve zero-defect production. Gaoying's KPO solution is a state-of-the-art process optimization solution based on artificial intelligence (AI) technology independently developed.

Through the KPO solution, operators can not only diagnose printing quality in real time while monitoring the printing process to provide information for process analysis, but also automatically optimize the printing process in real time through the main process variables proposed by AI technology without the intervention of process experts.High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)
High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)High Precision Automatic Semiconductor 3D Solder Paste Inspection (SPI)
Koh Young pioneered True 3D measurement technology 20 years ago, ushering in a future of Zero Defects. This led to KSMART solutions and its continued utilization of
Feature:

• True patented 3D volume measurement

• Highest accuracy and repeatability

• Solder paste printing optimization - at its best

• Low cost of ownership, fast ROI

• Accurate, powerful SPC tool package
What we can do for you?
One-stop SMT Solution Supplier, Reliable SMT Partner.
Are you a trade company or manufacturer?
Full SMT machines maufacturer for smt line in China; OEM & ODM service are available.

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